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Gold-palladium/gold-palladium-copper alloy plating

This collection primarily includes sulfurous acid-based plating solutions, with colors ranging from light pink to white, which can be adjusted by varying the proportion of gold, palladium and copper. Different plating thicknesses can be achieved by varying the metal concentrations. Therefore, they are widely used in glasses and jewelry. Because of different metal combinations, the colors of this collection cannot be achieved by general alloy plating. This collection has a long history in Japan, where the technology in using this collection is stable and well-established. Therefore, it is also called “Japanese gold”. The plating layer is mainly composed of gold and palladium, which has high corrosion resistance and wear resistance. It passes both salt spray test and nickel-free test, making it a critical plating solution for manufacturing high-end products. Some major products are introduced below:

APG gold-palladium (gold) alloy plating solution

P032

0.2~0.8

0.6

Gold:5

Palladium:3

Copper:0.005

 

Used in thick gold plating; can achieve a thickness of 2μ; bright color; light pink, which can be adjusted by varying the current density; stable and reliable; used in manufacturing of high-end products

APG gold-palladium (gold) alloy plating solution (low concentration)

P245

0.2~0.8

0.5

Gold:2

Palladium:1

Copper:0.005

 

Used in thick gold plating; can achieve a thickness of 1μ; bright color; light pink, which can be adjusted by varying the current density; stable and reliable; used in manufacturing of high-end products

APG gold-palladium (gold) alloy plating solution (low concentration)

P617

0.2~0.8

0.5

Gold:2

Palladium:0.5

Copper:0.005

 

Used in thick gold plating; can achieve a thickness of 1μ; bright color; light pink, which can be adjusted by varying the current density; stable and reliable; used in manufacturing of high-end products

AP gold-palladium (pink gold) alloy plating solution

P426

0.2~0.8

0.6

Gold:5

Palladium:1

Copper:0.2

 

Used in thick gold plating; can achieve a thickness of 2μ; bright color; dark pink, which can be adjusted by varying the current density; stable and reliable; used in manufacturing of high-end products

AP-White white gold plating solution

P827

0.2~0.8

0.6

Gold:2

Palladium:3

Copper:0.01

 

Used in thick gold plating; can achieve a thickness of 2μ; bright color; dark pink, which can be adjusted by varying the current density; stable and reliable; used in manufacturing of high-end products

APL gold-palladium alloy plating solution

P639

0.2~1.0

0.5

Gold:2

Palladium:1

Copper:0.01

 

Used in thick gold plating; can achieve a thickness of 1μ; bright color; dark pink, which can be adjusted by varying the current density; stable and reliable; used in manufacturing of high-end products

Gold-palladium plating solution for flash plating

P660

0.5~2.0

Gold:1

Palladium:0.2

 

 

Used in surface plating; bright color; light pink, which can be adjusted by varying the current density; stable and reliable; used in manufacturing of high-end products at a low cost for its low metal concentration

 

APS gold-palladium-copper plating solution

P454

0.5~2.0

Gold:0.5

Palladium:0.2

Copper:0.005

 

Used in surface plating; bright color; dark pink, which can be adjusted by varying the current density; stable and reliable; used in manufacturing of high-end products at a low cost for its low metal concentration

 

Product code

Metal content (g/L)

2

Product code

Current density (A/dm2)

Plating rate (μ/min)

Metal content (g/L)

Properties

2

Plating rate (μ/min)

Properties

Current density (A/dm2)

Product code

Current density (A/dm2)

2

Plating rate (μ/min)

Metal content (g/L)

Properties

Product code

Current density (A/dm2)

2

Plating rate (μ/min)

Metal content (g/L)

Properties

Product code

Current density (A/dm2)

2

Plating rate (μ/min)

Metal content (g/L)

Properties

Product code

Current density (A/dm2)

2

Plating rate (μ/min)

Metal content (g/L)

Properties

Product code

Current density (A/dm2)

2

Plating rate (μ/min)

Metal content (g/L)

Properties

Product code

Current density (A/dm2)

2

Plating rate (μ/min)

Metal content (g/L)

Properties

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